Noida| 12 February 2026: Taiwan-based electronics manufacturing giant Foxconn has taken a significant step in strengthening its India supply-chain strategy with the foundation-laying of a ₹3,706-crore HCL-Foxconn semiconductor assembly and testing facility in Greater Noida.
The project, being developed through a joint venture operating as Vamasundari Investments (P) Limited, will establish a compound semiconductor and sensor manufacturing unit equipped with Assembly, Testing, Marking and Packaging (ATMP) and Outsourced Semiconductor Assembly and Test (OSAT) capabilities.
The facility is part of India’s broader semiconductor push under the India Semiconductor Mission and follows the government’s approval of the Foxconn-backed venture in 2025 as one of six projects selected to expand domestic chip manufacturing capacity.
Strategic Move in Foxconn’s Global Supply Chain Diversification
The 48-acre plant in the Yamuna Expressway Industrial Development Authority (YEIDA) region reflects Foxconn’s ongoing strategy to diversify semiconductor supply chains beyond East Asia while aligning with India’s growing electronics manufacturing ecosystem.
Once operational, the facility is expected to process around 20,000 wafers per month and produce display driver chips used across mobile devices, laptops, automobiles, and consumer electronics—components that are critical to global display technology supply chains.
By focusing on ATMP and OSAT services, the project targets a segment historically dominated by East Asian markets, enabling India to localise back-end semiconductor processes such as wafer dicing, chip packaging, testing, and marking.
Policy and Infrastructure Alignment Driving Investment
The project’s inauguration, attended by senior government leaders including Uttar Pradesh Chief Minister Yogi Adityanath and Union Electronics Minister Ashwini Vaishnaw, highlighted the policy importance attached to semiconductor ecosystem development.
“It is a big step in Uttar Pradesh’s push to build a semiconductor manufacturing ecosystem near the upcoming airport in Jewar”
–Shailendra Bhatia, Additional CEO of YEIDA
YEIDA Additional CEO Shailendra Bhatia confirmed the underlining the role of infrastructure connectivity in attracting advanced manufacturing investments. The plant’s proximity to the Noida International Airport is expected to improve logistics efficiency for semiconductor materials and exports, a key factor given the time-sensitive nature of chip supply chains.

Ask an Expert